90/015,902Wire Bond Mold Lock Method and Structure9,685,351Open

Status

Non-Final Action Mailed

Filed

Jan 23, 2026

Last Updated

Jun 8, 2026

Examiner

Woo H Choi

Art Unit

3992

Requester Law Firm

Unknown

Requested By

Third Party

Patent Owner

NXP USA Inc.

P.O. Law Firm

Bunsow De Mory, LLP

Sector (CPC)

HElectrical & Electronic
H01Electrical Components
H01LSemiconductor Devices

USPC

257Active Solid-State Devices (E.g., Transistors, Solid-State Diodes)

Reexam History (31 events)

Jun 8, 2026MR.NFRX - Mail Reexam Non-Final Action
May 27, 2026MRDRXRX - Mail Decision Merging Reexam and Reissue Proceedings -- Reexam
May 14, 2026RXFWDXDate Forwarded to Examiner
Mar 19, 2026PA..Change in Power of Attorney (May Include Associate POA)
Mar 18, 2026RXC.ADCorrespondence Address Change
Mar 12, 2026RXC/SRCertificate of Service
Mar 12, 2026RXPA..Change in Power of Attorney (May Include Associate POA)
Mar 2, 2026MREXORX - Mail Ex Parte Request for Reexamination Granted
Mar 2, 2026RXRLFReExam Litigation Found
Mar 2, 2026RXLITSRReexam Litigation Search Conducted
Jan 30, 2026MRXNReexamination Formalities Notice Mailed
Jan 30, 2026DOCKCase Docketed to Examiner in GAU
Jan 30, 2026MRXNReexamination Formalities Notice Mailed
Jan 30, 2026COMPApplication Is Now Complete
Jan 29, 2026RXPCOMCompletion of Preprocessing - Released to Assigned GAU
Jan 29, 2026FTFSFITF set to YES - revise initial setting
Jan 29, 2026PRXRParalegal Reexam Review Complete
Jan 29, 2026RXC.ADRReexam - Correspondence Address Change for Third Party Requester
Jan 29, 2026RXNREQAUNotice of assignment of reexamination request
Jan 29, 2026RXNREQFDNotice of reexamination request filing date
Jan 27, 2026RXRLFReExam Litigation Found
Jan 27, 2026RXTTLRPTTitle Report
Jan 27, 2026RXLITSRReexam Litigation Search Conducted
Jan 23, 2026RXPA..RReexam - Change in Power of Attorney (May Include Associate POA) for Third Party Requester
Jan 23, 2026RXOSUBReceipt of Original Ex Parte Reexam Request
Jan 23, 2026RXOSUB.RReexamination requested by third party requester
Jan 23, 2026WIDSInformation Disclosure Statement (IDS) Filed
Jan 23, 2026BIG.Entity Status Set To Undiscounted (Initial Default Setting or Status Change)
Jan 23, 2026RXIDS.RReexam - Information Disclosure Statement Filed by Third Party Requester
Jan 23, 2026RXAF/DAffidavit(s), Declaration(s) and/or Exhibit(s) Filed
Jan 23, 2026RXAF/DRReexam - Affidavit(s), Declaration(s) and/or Exhibit(s) Filed by Third Party Requester

Prosecution, PTAB & CAFC

PTAB Proceedings (IPR, PGR, CBM, DER)

None found

Federal Circuit (CAFC)

None found

Terminal Disclaimer

None found

Prosecution History

None found

Maintenance Fees

Grant
Jun 20, 2017
3.5-yr
Dec 20, 2020
Paid Sep 15, 2020
7.5-yr
Dec 20, 2024
Paid Sep 17, 2024
11.5-yr
Dec 20, 2028
Expiry
Jul 19, 2034

Entity Status

Large Entity

Expires

Jul 19, 2034 (8.3 yr remaining)

Term Adjustment

+1 days (~0.0 yr)

Assignments

2015201620172018201920202021202220232024FiledIII LEO M. HIGGINSFREESCALE SEMICONDUCTOR, INC.AS NOTES COLLATERAL AGENT N.A. CITIBANKAS NOTES COLLATERAL AGENT N.A. CITIBANKAS NOTES COLLATERAL AGENT N.A. CITIBANKMORGAN STANLEY SENIOR FUNDING, INC.NXP USA, INC.NXP USA, INC.CHIP PACKAGING TECHNOLOGIES, LLCN.A. CITIBANKSecurity InterestN.A. CITIBANKSecurity InterestAS COLLATERAL AGENT N.A. CITIBANKReleaseMORGAN STANLEY SENIOR FUNDING, INC.ReleaseMORGAN STANLEY SENIOR FUNDING, INC.ReleaseMORGAN STANLEY SENIOR FUNDING, INC.ReleaseMORGAN STANLEY SENIOR FUNDING, INC.ReleaseMORGAN STANLEY SENIOR FUNDING, INC.Release
AssignmentReel/Frame: 033344/0775Recorded: Jul 18, 2014

From

III LEO M. HIGGINSInventor
Jul 18, 2014

To

FREESCALE SEMICONDUCTOR, INC.

OtherReel/Frame: 034160/0370Recorded: Nov 4, 2014

From

FREESCALE SEMICONDUCTOR, INC.
Oct 30, 2014

To

AS NOTES COLLATERAL AGENT N.A. CITIBANK

OtherReel/Frame: 034160/0351Recorded: Nov 4, 2014

From

FREESCALE SEMICONDUCTOR, INC.
Oct 30, 2014

To

AS NOTES COLLATERAL AGENT N.A. CITIBANK

OtherReel/Frame: 034153/0027Recorded: Nov 4, 2014

From

FREESCALE SEMICONDUCTOR, INC.
Oct 30, 2014

To

AS NOTES COLLATERAL AGENT N.A. CITIBANK

Security InterestReel/Frame: 037458/0460Recorded: Jan 7, 2016

From

N.A. CITIBANK
Dec 7, 2015

To

MORGAN STANLEY SENIOR FUNDING, INC.

Security InterestReel/Frame: 037458/0502Recorded: Jan 7, 2016

From

N.A. CITIBANK
Dec 7, 2015

To

MORGAN STANLEY SENIOR FUNDING, INC.

ReleaseReel/Frame: 037357/0921Recorded: Dec 21, 2015

From

AS COLLATERAL AGENT N.A. CITIBANK
Dec 7, 2015

To

FREESCALE SEMICONDUCTOR, INC.

OtherReel/Frame: 039138/0001Recorded: Jun 16, 2016

From

FREESCALE SEMICONDUCTOR, INC.
May 25, 2016

To

MORGAN STANLEY SENIOR FUNDING, INC.

ReleaseReel/Frame: 052915/0001Recorded: Jan 17, 2020

From

MORGAN STANLEY SENIOR FUNDING, INC.
Jun 22, 2016

To

NXP B.V.

ReleaseReel/Frame: 040928/0001Recorded: Nov 7, 2016

From

MORGAN STANLEY SENIOR FUNDING, INC.
Jun 22, 2016

To

NXP B.V.

ReleaseReel/Frame: 052917/0001Recorded: Feb 17, 2020

From

MORGAN STANLEY SENIOR FUNDING, INC.
Sep 12, 2016

To

NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.

ReleaseReel/Frame: 040925/0001Recorded: Sep 21, 2016

From

MORGAN STANLEY SENIOR FUNDING, INC.
Sep 12, 2016

To

NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.

MergerReel/Frame: 041414/0883Recorded: Jan 12, 2017

From

FREESCALE SEMICONDUCTOR, INC. (UNDER)
Nov 4, 2016
NXP SEMICONDUCTORS USA, INC. (MERGED INTO)
Nov 7, 2016

To

NXP USA, INC.

Name ChangeReel/Frame: 040626/0683Recorded: Nov 16, 2016

From

FREESCALE SEMICONDUCTOR INC.
Nov 7, 2016

To

NXP USA, INC.

ReleaseReel/Frame: 050744/0097Recorded: Sep 10, 2019

From

MORGAN STANLEY SENIOR FUNDING, INC.
Sep 3, 2019

To

NXP B.V.

AssignmentReel/Frame: 068541/0903Recorded: Sep 10, 2024

From

NXP USA, INC.
Jul 31, 2024

To

CHIP PACKAGING TECHNOLOGIES, LLC