90/019,612SEMICONDUCTOR PACKAGE AND METHOD USING ISOLATED VSS PLANE TO ACCOMMODATE HIGH SPEED CIRCUITRY GROUND ISOLATION7,646,091Closed
Status
Reexamination Certificate Issued
Requester
Unknown
Requester Law Firm
Requested By
Third Party
Patent OwnerInferred
P.O. Law Firm
Reexam History (34 events)
Prosecution, PTAB & CAFC
PTAB Proceedings (IPR, PGR, CBM, DER)
Petitioner
NXP USA, Inc. et al.
Petition Filed
Nov 9, 2023
Institution
May 13, 2024
Decision
May 13, 2024
Terminated
May 13, 2024
Federal Circuit (CAFC)
None found
Terminal Disclaimer
None found
Prosecution History
None found
Maintenance Fees
Entity Status
Large Entity
Expires
Jun 13, 2027 (1.2 yr remaining)
Term Adjustment
+433 days (~1.2 yr)
Assignments
From
To
LSI LOGIC CORPORATION
From
To
LSI CORPORATION
From
To
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
From
To
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
From
To
BANK OF AMERICA, N.A., AS COLLATERAL AGENT
From
To
LSI CORPORATION
From
To
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
From
To
BELL SEMICONDUCTOR, LLC
From
To
CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
From
To
HILCO PATENT ACQUISITION 56, LLC