90/015,762LEADFRAME STRUCTURE FOR ELECTRONIC PACKAGES8,258,611Open

Status

Non-Final Action Mailed

Filed

Dec 9, 2025

Last Updated

Jul 30, 2026

Art Unit

3992

Requester Law Firm

Unknown

Requested By

Third Party

Patent Owner

NXP B.V.

P.O. Law Firm

Bunsow De Mory, LLP

Sector (CPC)

HElectrical & Electronic
H01Electrical Components
H01LSemiconductor Devices

USPC

257Active Solid-State Devices (E.g., Transistors, Solid-State Diodes)

Reexam History (46 events)

Jul 30, 2026MR.NFRX - Mail Reexam Non-Final Action
Jul 29, 2026MRDRXRX - Mail Decision Merging Reexam and Reissue Proceedings -- Reexam
Jul 14, 2026DOCKCase Docketed to Examiner in GAU
May 14, 2026RXFWDXDate Forwarded to Examiner
Mar 19, 2026PA..Change in Power of Attorney (May Include Associate POA)
Mar 18, 2026RXC.ADCorrespondence Address Change
Mar 18, 2026RXC.ADRReexam - Correspondence Address Change for Third Party Requester
Mar 13, 2026RXPA..RReexam - Change in Power of Attorney (May Include Associate POA) for Third Party Requester
Mar 13, 2026RXC/SRCertificate of Service
Mar 12, 2026RXC/SRCertificate of Service
Mar 12, 2026RXPA..Change in Power of Attorney (May Include Associate POA)
Jan 29, 2026MREXORX - Mail Ex Parte Request for Reexamination Granted
Jan 13, 2026MRXNReexamination Formalities Notice Mailed
Jan 13, 2026COMPApplication Is Now Complete
Jan 13, 2026MPENMail Pre-Exam Notice
Jan 13, 2026MRXNReexamination Formalities Notice Mailed
Jan 12, 2026COMPApplication Is Now Complete
Jan 12, 2026COMPApplication Is Now Complete
Jan 12, 2026MRXNReexamination Formalities Notice Mailed
Jan 12, 2026W/OAPre-Exam Office Action Withdrawn
Jan 12, 2026MRXNReexamination Formalities Notice Mailed
Jan 12, 2026MPENMail Pre-Exam Notice
Jan 12, 2026MRXNReexamination Formalities Notice Mailed
Jan 12, 2026MRXNReexamination Formalities Notice Mailed
Jan 12, 2026ROIPEApplication Return TO OIPE
Jan 12, 2026W/OAPre-Exam Office Action Withdrawn
Jan 12, 2026DOCKCase Docketed to Examiner in GAU
Jan 12, 2026WROIPEApplication Return from OIPE
Jan 11, 2026ROIPEApplication Return TO OIPE
Jan 11, 2026RXPCOMCompletion of Preprocessing - Released to Assigned GAU
Jan 11, 2026RXNREQAUNotice of assignment of reexamination request
Jan 11, 2026RXNREQFDNotice of reexamination request filing date
Jan 11, 2026WROIPEApplication Return from OIPE
Jan 8, 2026FTFIFITF set to NO - revise initial setting
Jan 8, 2026RXRLFReExam Litigation Found
Jan 8, 2026PRIRParalegal Reissue Review Complete
Jan 8, 2026RXLITSRReexam Litigation Search Conducted
Dec 11, 2025RXTTLRPTTitle Report
Dec 9, 2025RXIDS.RReexam - Information Disclosure Statement Filed by Third Party Requester
Dec 9, 2025RXOSUB.RReexamination requested by third party requester
Dec 9, 2025BIG.Entity Status Set To Undiscounted (Initial Default Setting or Status Change)
Dec 9, 2025RXOSUBReceipt of Original Ex Parte Reexam Request
Dec 9, 2025RXIDS.RReexam - Information Disclosure Statement Filed by Third Party Requester
Dec 9, 2025CLAIMClaim Preliminary Amendment
Dec 9, 2025RXC/SRCertificate of Service
Dec 9, 2025RXAF/DRReexam - Affidavit(s), Declaration(s) and/or Exhibit(s) Filed by Third Party Requester

Prosecution, PTAB & CAFC

PTAB Proceedings (IPR, PGR, CBM, DER)

None found

Federal Circuit (CAFC)

None found

Terminal Disclaimer

None found

Prosecution History

None found

Maintenance Fees

Grant
Sep 4, 2012
3.5-yr
Mar 4, 2016
7.5-yr
Mar 4, 2020
Paid Dec 17, 2019
11.5-yr
Mar 4, 2024
Paid Dec 12, 2023
Expiry
Oct 16, 2030

Entity Status

Large Entity

Expires

Oct 16, 2030 (4.5 yr remaining)

Term Adjustment

+274 days (~0.8 yr)

Assignments

2009201020112012201320142015201620172018201920202021202220232024FiledPETER SCHELWALDRONALD SCHRAVENDEELNXP B.V.NXP B.V.NXP B.V.NXP B.V.NXP B.V.NXP B.V.NXP B.V.NXP B.V.NXP B.V.NXP B.V.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.CHIP PACKAGING TECHNOLOGIES, LLCMORGAN STANLEY SENIOR FUNDING, INC.Release
AssignmentReel/Frame: 023797/0766Recorded: Jan 15, 2010

From

PETER SCHELWALDInventor
Jul 17, 2008
RONALD SCHRAVENDEELInventor
Jul 17, 2008

To

NXP B.V.

AssignmentReel/Frame: 051145/0184Recorded: Oct 22, 2019

From

NXP B.V.
Feb 18, 2016

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 051030/0001Recorded: Oct 22, 2019

From

NXP B.V.
Feb 18, 2016

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 051029/0001Recorded: Oct 22, 2019

From

NXP B.V.
Feb 18, 2016

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 051029/0387Recorded: Oct 22, 2019

From

NXP B.V.
Feb 18, 2016

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 042985/0001Recorded: May 9, 2017

From

NXP B.V.
Feb 18, 2016

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 042762/0145Recorded: May 9, 2017

From

NXP B.V.
Feb 18, 2016

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 039361/0212Recorded: Jul 14, 2016

From

NXP B.V.
Feb 18, 2016

To

MORGAN STANLEY SENIOR FUNDING, INC.

OtherReel/Frame: 038017/0058Recorded: Mar 7, 2016

From

NXP B.V.
Feb 18, 2016

To

MORGAN STANLEY SENIOR FUNDING, INC.

ReleaseReel/Frame: 050745/0001Recorded: Sep 10, 2019

From

MORGAN STANLEY SENIOR FUNDING, INC.
Sep 3, 2019

To

NXP B.V.

AssignmentReel/Frame: 068542/0027Recorded: Sep 10, 2024

From

NXP B.V.
Jul 31, 2024

To

CHIP PACKAGING TECHNOLOGIES, LLC