Advanced Semiconductor Engineering Inc.
Ex parte reexamination requester·2 ex parte reexams
Advanced Semiconductor Engineering Inc. has requested 2 USPTO ex parte reexaminations, with 2 currently open. It most often challenges patents owned by NXP BV and NXP B.V.. ExamPat indexes the full prosecution record for each proceeding, including office-action grounds, certificate outcomes, and downstream PTAB and Federal Circuit decisions.
Outcome track record
How this requester's challenges resolve: claims confirmed, amended, mixed, or fully canceled.
- Certificate outcome split across every bucket
- Share of challenges that canceled claims
Challenge metrics
Cancellation rate, average pendency, and the open/closed split across every reexam this requester has filed.
- Outcome rate of closed challenges
- Average pendency in months
Examiners & defense counsel
Which examiners decide this requester's challenges, and which firms defend the targeted patents.
- Most frequent examiners
- Top opposing counsel
Recent reexaminations (2)
| Control # | Filed | Patent | Title | Owner | Status |
|---|---|---|---|---|---|
| 90/015,860 | Jan 5, 2026 | 9,685,351 | Wire Bond Mold Lock Method and Structure | NXP BV | Open |
| 90/015,762 | Dec 9, 2025 | 8,258,611 | LEADFRAME STRUCTURE FOR ELECTRONIC PACKAGES | NXP B.V. | Open |
See the full reexam picture for Advanced Semiconductor Engineering Inc.
Certificate outcomes, pendency, and the parties and examiners behind these cases. Free to sign up.