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90/015,860Wire Bond Mold Lock Method and Structure9,685,351Open

Status

Non-Final Action Mailed

Filed

Jan 5, 2026

Last Updated

Jun 8, 2026

Examiner

Woo H Choi

Art Unit

3992

Requester Law Firm

K&L Gates, LLP

Requested By

Third Party

Patent Owner

NXP B.V.

P.O. Law Firm

Bunsow De Mory, LLP

Sector (CPC)

HElectrical & Electronic
H01Electrical Components
H01LSemiconductor Devices

USPC

257Active Solid-State Devices (E.g., Transistors, Solid-State Diodes)

Reexam History (26 events)

Jun 8, 2026MR.NFRX - Mail Reexam Non-Final Action
May 27, 2026MRDRXRX - Mail Decision Merging Reexam and Reissue Proceedings -- Reexam
May 26, 2026RXFWDXDate Forwarded to Examiner
Mar 19, 2026PA..Change in Power of Attorney (May Include Associate POA)
Mar 18, 2026RXC.ADCorrespondence Address Change
Mar 12, 2026RXPA..Change in Power of Attorney (May Include Associate POA)
Mar 12, 2026RXC/SRCertificate of Service
Mar 2, 2026MREXORX - Mail Ex Parte Request for Reexamination Granted
Jan 22, 2026DOCKCase Docketed to Examiner in GAU
Jan 21, 2026MRXNReexamination Formalities Notice Mailed
Jan 21, 2026MRXNReexamination Formalities Notice Mailed
Jan 21, 2026COMPApplication Is Now Complete
Jan 20, 2026SMALApplicant Has Filed a Verified Statement of Small Entity Status in Compliance with 37 CFR 1.27
Jan 20, 2026RXTTLRPTTitle Report
Jan 20, 2026RXPCOMCompletion of Preprocessing - Released to Assigned GAU
Jan 20, 2026RXNREQFDNotice of reexamination request filing date
Jan 20, 2026RXNREQAUNotice of assignment of reexamination request
Jan 7, 2026PRXRParalegal Reexam Review Complete
Jan 7, 2026FTFSFITF set to YES - revise initial setting
Jan 5, 2026WIDSInformation Disclosure Statement (IDS) Filed
Jan 5, 2026RXOSUBReceipt of Original Ex Parte Reexam Request
Jan 5, 2026RXO_40.RReceipt of Orig. Ex Parte Request by Third Party Less Than 40 Pages - Rule 1.20(c )(1)
Jan 5, 2026RXIDS.RReexam - Information Disclosure Statement Filed by Third Party Requester
Jan 5, 2026RXC/SRCertificate of Service
Jan 5, 2026RXAF/DAffidavit(s), Declaration(s) and/or Exhibit(s) Filed
Jan 5, 2026BIG.Entity Status Set To Undiscounted (Initial Default Setting or Status Change)

Prosecution, PTAB & CAFC

PTAB Proceedings (IPR, PGR, CBM, DER)

None found

Federal Circuit (CAFC)

None found

Terminal Disclaimer

None found

Prosecution History

None found

Maintenance Fees

Grant
Jun 20, 2017
3.5-yr
Dec 20, 2020
Paid Sep 15, 2020
7.5-yr
Dec 20, 2024
Paid Sep 17, 2024
11.5-yr
Dec 20, 2028
Expiry
Jul 19, 2034

Entity Status

Large Entity

Expires

Jul 19, 2034 (8.3 yr remaining)

Term Adjustment

+1 days (~0.0 yr)

Assignments

2015201620172018201920202021202220232024FiledIII LEO M. HIGGINSFREESCALE SEMICONDUCTOR, INC.AS NOTES COLLATERAL AGENT N.A. CITIBANKAS NOTES COLLATERAL AGENT N.A. CITIBANKAS NOTES COLLATERAL AGENT N.A. CITIBANKMORGAN STANLEY SENIOR FUNDING, INC.NXP USA, INC.NXP USA, INC.CHIP PACKAGING TECHNOLOGIES, LLCN.A. CITIBANKSecurity InterestN.A. CITIBANKSecurity InterestAS COLLATERAL AGENT N.A. CITIBANKReleaseMORGAN STANLEY SENIOR FUNDING, INC.ReleaseMORGAN STANLEY SENIOR FUNDING, INC.ReleaseMORGAN STANLEY SENIOR FUNDING, INC.ReleaseMORGAN STANLEY SENIOR FUNDING, INC.ReleaseMORGAN STANLEY SENIOR FUNDING, INC.Release
AssignmentReel/Frame: 033344/0775Recorded: Jul 18, 2014

From

III LEO M. HIGGINSInventor
Jul 18, 2014
→

To

FREESCALE SEMICONDUCTOR, INC.

OtherReel/Frame: 034160/0370Recorded: Nov 4, 2014

From

FREESCALE SEMICONDUCTOR, INC.
Oct 30, 2014
→

To

AS NOTES COLLATERAL AGENT N.A. CITIBANK

OtherReel/Frame: 034160/0351Recorded: Nov 4, 2014

From

FREESCALE SEMICONDUCTOR, INC.
Oct 30, 2014
→

To

AS NOTES COLLATERAL AGENT N.A. CITIBANK

OtherReel/Frame: 034153/0027Recorded: Nov 4, 2014

From

FREESCALE SEMICONDUCTOR, INC.
Oct 30, 2014
→

To

AS NOTES COLLATERAL AGENT N.A. CITIBANK

Security InterestReel/Frame: 037458/0460Recorded: Jan 7, 2016

From

N.A. CITIBANK
Dec 7, 2015
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

Security InterestReel/Frame: 037458/0502Recorded: Jan 7, 2016

From

N.A. CITIBANK
Dec 7, 2015
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

ReleaseReel/Frame: 037357/0921Recorded: Dec 21, 2015

From

AS COLLATERAL AGENT N.A. CITIBANK
Dec 7, 2015
→

To

FREESCALE SEMICONDUCTOR, INC.

OtherReel/Frame: 039138/0001Recorded: Jun 16, 2016

From

FREESCALE SEMICONDUCTOR, INC.
May 25, 2016
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

ReleaseReel/Frame: 052915/0001Recorded: Jan 17, 2020

From

MORGAN STANLEY SENIOR FUNDING, INC.
Jun 22, 2016
→

To

NXP B.V.

ReleaseReel/Frame: 040928/0001Recorded: Nov 7, 2016

From

MORGAN STANLEY SENIOR FUNDING, INC.
Jun 22, 2016
→

To

NXP B.V.

ReleaseReel/Frame: 052917/0001Recorded: Feb 17, 2020

From

MORGAN STANLEY SENIOR FUNDING, INC.
Sep 12, 2016
→

To

NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.

ReleaseReel/Frame: 040925/0001Recorded: Sep 21, 2016

From

MORGAN STANLEY SENIOR FUNDING, INC.
Sep 12, 2016
→

To

NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.

MergerReel/Frame: 041414/0883Recorded: Jan 12, 2017

From

FREESCALE SEMICONDUCTOR, INC. (UNDER)
Nov 4, 2016
NXP SEMICONDUCTORS USA, INC. (MERGED INTO)
Nov 7, 2016
→

To

NXP USA, INC.

Name ChangeReel/Frame: 040626/0683Recorded: Nov 16, 2016

From

FREESCALE SEMICONDUCTOR INC.
Nov 7, 2016
→

To

NXP USA, INC.

ReleaseReel/Frame: 050744/0097Recorded: Sep 10, 2019

From

MORGAN STANLEY SENIOR FUNDING, INC.
Sep 3, 2019
→

To

NXP B.V.

AssignmentReel/Frame: 068541/0903Recorded: Sep 10, 2024

From

NXP USA, INC.
Jul 31, 2024
→

To

CHIP PACKAGING TECHNOLOGIES, LLC