CHIP PACKAGING TECHNOLOGIES, LLC
Patent owner in reexamination·8 ex parte reexams
CHIP PACKAGING TECHNOLOGIES, LLC's patents have been the subject of 8 USPTO ex parte reexaminations, with 8 currently open. Its patents are most often challenged by Infineon Technologies AG, STMicroelectronics, Inc., and Advanced Semiconductor Engineering, Inc.. ExamPat indexes the full prosecution record for each proceeding, including office-action grounds, certificate outcomes, and downstream PTAB and Federal Circuit decisions.
Filings by year
Outcome track record
How reexams of this owner's patents resolve: claims confirmed, amended, mixed, or fully canceled.
- Certificate outcome split across every bucket
- Claim-survival rate
Defense metrics
Claim-survival rate, average pendency, and the open/closed split across every reexam of this owner's patents.
- Survival rate of closed proceedings
- Average pendency in months
Challengers & examiners
Which requesters most often challenge this owner's patents, and which examiners decide them.
- Top requesters
- Most frequent examiners
Recent reexaminations (8)
| Control # | Filed | Patent | Title | Requester | Status |
|---|---|---|---|---|---|
| 90/016,347 | May 28, 2026 | 10,151,658 | PRESSURE-SENSING INTEGRATED CIRCUIT DEVICE WITH DIAPHRAGM | STMicroelectronics, Inc. | Open |
| 90/016,343 | May 27, 2026 | 8,643,189 | PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS | STMicroelectronics, Inc. | Open |
| 90/016,057 | Mar 18, 2026 | 9,299,646 | LEAD FRAME WITH POWER AND GROUND BARS | Infineon Technologies AG | Open |
| 90/015,993 | Feb 25, 2026 | 9,263,299 | EXPOSED DIE CLIP BOND POWER PACKAGE | Infineon Technologies AG | Open |
| 90/015,902 | Jan 23, 2026 | 9,685,351 | Wire Bond Mold Lock Method and Structure | Infineon Technologies AG | Open |
| 90/015,888 | Jan 15, 2026 | 8,258,611 | LEADFRAME STRUCTURE FOR ELECTRONIC PACKAGES | Infineon Technologies AG | Open |
| 90/015,860 | Jan 5, 2026 | 9,685,351 | Wire Bond Mold Lock Method and Structure | Advanced Semiconductor Engineering, Inc. | Open |
| 90/015,762 | Dec 9, 2025 | 8,258,611 | LEADFRAME STRUCTURE FOR ELECTRONIC PACKAGES | Advanced Semiconductor Engineering, Inc. | Open |
See the full reexam picture for CHIP PACKAGING TECHNOLOGIES, LLC
Certificate outcomes, pendency, and the parties and examiners behind these cases. Free to sign up.