Chip Packaging Technologies LLC
Patent owner in reexamination·4 ex parte reexams
Chip Packaging Technologies LLC's patents have been the subject of 4 USPTO ex parte reexaminations, with 4 currently open. Its patents are most often challenged by STMicroelectronics Inc. and Infineon Technologies AG c/o Kurt M. Pankratz. ExamPat indexes the full prosecution record for each proceeding, including office-action grounds, certificate outcomes, and downstream PTAB and Federal Circuit decisions.
Filings by year
Outcome track record
How reexams of this owner's patents resolve: claims confirmed, amended, mixed, or fully canceled.
- Certificate outcome split across every bucket
- Claim-survival rate
Defense metrics
Claim-survival rate, average pendency, and the open/closed split across every reexam of this owner's patents.
- Survival rate of closed proceedings
- Average pendency in months
Challengers & examiners
Which requesters most often challenge this owner's patents, and which examiners decide them.
- Top requesters
- Most frequent examiners
Recent reexaminations (4)
| Control # | Filed | Patent | Title | Requester | Status |
|---|---|---|---|---|---|
| 90/016,347 | May 28, 2026 | 10,151,658 | PRESSURE-SENSING INTEGRATED CIRCUIT DEVICE WITH DIAPHRAGM | STMicroelectronics Inc. | Open |
| 90/016,343 | May 27, 2026 | 8,643,189 | PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS | — | Open |
| 90/016,057 | Mar 18, 2026 | 9,299,646 | LEAD FRAME WITH POWER AND GROUND BARS | — | Open |
| 90/015,993 | Feb 25, 2026 | 9,263,299 | EXPOSED DIE CLIP BOND POWER PACKAGE | Infineon Technologies AG c/o Kurt M. Pankratz | Open |
See the full reexam picture for Chip Packaging Technologies LLC
Certificate outcomes, pendency, and the parties and examiners behind these cases. Free to sign up.