90/015,993EXPOSED DIE CLIP BOND POWER PACKAGE9,263,299Open

Status

Determination - Reexamination Ordered

Filed

Feb 25, 2026

Last Updated

May 4, 2026

Art Unit

3991

Requester Law Firm

Unknown

Requested By

Third Party

P.O. Law Firm

Bunsow De Mory, LLP

Sector (CPC)

HElectrical & Electronic
H01Electrical Components
H01LSemiconductor Devices

USPC

438Semiconductor Device Manufacturing: Process

Reexam History (23 events)

May 4, 2026MREXORX - Mail Ex Parte Request for Reexamination Granted
Apr 13, 2026IDSCInformation Disclosure Statement considered
Mar 19, 2026PA..Change in Power of Attorney (May Include Associate POA)
Mar 9, 2026DOCKCase Docketed to Examiner in GAU
Mar 6, 2026MRXNReexamination Formalities Notice Mailed
Mar 6, 2026MRXNReexamination Formalities Notice Mailed
Mar 6, 2026COMPApplication Is Now Complete
Mar 5, 2026RXPCOMCompletion of Preprocessing - Released to Assigned GAU
Mar 5, 2026RXNREQFDNotice of reexamination request filing date
Mar 5, 2026RXNREQAUNotice of assignment of reexamination request
Mar 5, 2026RXC/SRCertificate of Service
Mar 5, 2026RXC.ADRReexam - Correspondence Address Change for Third Party Requester
Mar 5, 2026FTFSFITF set to YES - revise initial setting
Feb 27, 2026PRXRParalegal Reexam Review Complete
Feb 25, 2026WIDSInformation Disclosure Statement (IDS) Filed
Feb 25, 2026RXTTLRPTTitle Report
Feb 25, 2026RXRLFReExam Litigation Found
Feb 25, 2026RXPA..RReexam - Change in Power of Attorney (May Include Associate POA) for Third Party Requester
Feb 25, 2026RXOSUB.RReexamination requested by third party requester
Feb 25, 2026RXOSUBReceipt of Original Ex Parte Reexam Request
Feb 25, 2026RXLITSRReexam Litigation Search Conducted
Feb 25, 2026RXIDS.RReexam - Information Disclosure Statement Filed by Third Party Requester
Feb 25, 2026BIG.Entity Status Set To Undiscounted (Initial Default Setting or Status Change)

Prosecution, PTAB & CAFC

PTAB Proceedings (IPR, PGR, CBM, DER)

None found

Federal Circuit (CAFC)

None found

Terminal Disclaimer

None found

Prosecution History

None found

Maintenance Fees

Grant
Feb 16, 2016
3.5-yr
Aug 16, 2019
Paid Jun 26, 2019
7.5-yr
Aug 16, 2023
Paid Jun 16, 2023
11.5-yr
Aug 16, 2027
Expiry
Jul 2, 2034

Entity Status

Large Entity

Expires

Jul 2, 2034 (8.3 yr remaining)

Assignments

2015201620172018201920202021202220232024FiledEMIL CASEY ISRAELLEONARDUS ANTONIUS ELISABETH VAN GEMERTNXP B.V.NXP B.V.CHIP PACKAGING TECHNOLOGIES, LLC
AssignmentReel/Frame: 033234/0902Recorded: Jul 2, 2014

From

EMIL CASEY ISRAELInventor
Jun 27, 2014
LEONARDUS ANTONIUS ELISABETH VAN GEMERTInventor
Jun 27, 2014

To

NXP B.V.

AssignmentReel/Frame: 068542/0027Recorded: Sep 10, 2024

From

NXP B.V.
Jul 31, 2024

To

CHIP PACKAGING TECHNOLOGIES, LLC