Infineon Technologies AG c/o Kurt M. Pankratz
Ex parte reexamination requester·2 ex parte reexams
Infineon Technologies AG c/o Kurt M. Pankratz has requested 2 USPTO ex parte reexaminations, with 2 currently open. It most often challenges patents owned by Chip Packaging Technologies LLC and NXP BV. ExamPat indexes the full prosecution record for each proceeding, including office-action grounds, certificate outcomes, and downstream PTAB and Federal Circuit decisions.
Filings by year
Top patent owners challenged
Outcome track record
How this requester's challenges resolve: claims confirmed, amended, mixed, or fully canceled.
- Certificate outcome split across every bucket
- Share of challenges that canceled claims
Challenge metrics
Cancellation rate, average pendency, and the open/closed split across every reexam this requester has filed.
- Outcome rate of closed challenges
- Average pendency in months
Examiners & defense counsel
Which examiners decide this requester's challenges, and which firms defend the targeted patents.
- Most frequent examiners
- Top opposing counsel
Recent reexaminations (2)
| Control # | Filed | Patent | Title | Owner | Status |
|---|---|---|---|---|---|
| 90/015,993 | Feb 25, 2026 | 9,263,299 | EXPOSED DIE CLIP BOND POWER PACKAGE | Chip Packaging Technologies LLC | Open |
| 90/015,888 | Jan 15, 2026 | 8,258,611 | LEADFRAME STRUCTURE FOR ELECTRONIC PACKAGES | NXP BV | Open |
See the full reexam picture for Infineon Technologies AG c/o Kurt M. Pankratz
Certificate outcomes, pendency, and the parties and examiners behind these cases. Free to sign up.