ExamPat
← Back to reexams

90/016,343PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS8,643,189Open

Status

Reexam - Request Ready for Ex Parte Action

Filed

May 27, 2026

Pre-Order Paper

Filed Jun 25, 2026

Last Updated

Sep 30, 2026

Examiner

Woo H Choi

Art Unit

3992

Requester Law Firm

Baker Botts L.L.P.

Requested By

Third Party

Patent Owner Law Firm

Owner hasn't filed yet

Sector (CPC)

HElectrical & Electronic
H01Electrical Components
H01LSemiconductor Devices

USPC

257Active Solid-State Devices (E.g., Transistors, Solid-State Diodes)

Reexam History (23 events)

Sep 30, 2026RXFWDXDate Forwarded to Examiner
Jul 20, 2026MREXORX - Mail Ex Parte Request for Reexamination Granted
Jun 25, 2026RXC/SRCertificate of Service
Jun 11, 2026DOCKCase Docketed to Examiner in GAU
Jun 10, 2026PA..Change in Power of Attorney (May Include Associate POA)
Jun 10, 2026MRXNReexamination Formalities Notice Mailed
Jun 10, 2026MRXNReexamination Formalities Notice Mailed
Jun 10, 2026COMPApplication Is Now Complete
Jun 9, 2026RXPCOMCompletion of Preprocessing - Released to Assigned GAU
Jun 9, 2026RXNREQFDNotice of reexamination request filing date
Jun 9, 2026RXNREQAUNotice of assignment of reexamination request
Jun 9, 2026FTFIFITF set to NO - revise initial setting
Jun 5, 2026PRXRParalegal Reexam Review Complete
May 27, 2026WIDSInformation Disclosure Statement (IDS) Filed
May 27, 2026RXTTLRPTTitle Report
May 27, 2026RXRLFReExam Litigation Found
May 27, 2026RXOSUB.RReexamination requested by third party requester
May 27, 2026RXOSUBReceipt of Original Ex Parte Reexam Request
May 27, 2026RXLITSRReexam Litigation Search Conducted
May 27, 2026RXIDS.RReexam - Information Disclosure Statement Filed by Third Party Requester
May 27, 2026RXC/SRCertificate of Service
May 27, 2026RXAF/DRReexam - Affidavit(s), Declaration(s) and/or Exhibit(s) Filed by Third Party Requester
May 27, 2026BIG.Entity Status Set To Undiscounted (Initial Default Setting or Status Change)

Prosecution, PTAB & CAFC

PTAB Proceedings (IPR, PGR, CBM, DER)

None found

Federal Circuit (CAFC)

None found

Terminal Disclaimer

None found

Prosecution History

None found

Maintenance Fees

Grant
Feb 4, 2014
3.5-yr
Aug 4, 2017
7.5-yr
Aug 4, 2021
Paid Jun 16, 2021
11.5-yr
Aug 4, 2025
Paid Feb 4, 2025
Expiry
Jul 17, 2032

Entity Status

Large Entity

Expires

Jul 17, 2032 (6.1 yr remaining)

Assignments

201320142015201620172018201920202021202220232024FiledNAVAS KHAN ORATTI KALANDARBOON YEW LOWLAN CHU TANNXP B.V.NXP B.V.NXP B.V.NXP B.V.NXP B.V.NXP B.V.NXP B.V.NXP B.V.FREESCALE SEMICONDUCTOR, INC.AS NOTES COLLATERAL AGENT N.A. CITIBANKAS NOTES COLLATERAL AGENT N.A. CITIBANKAS NOTES COLLATERAL AGENT N.A. CITIBANKAS NOTES COLLATERAL AGENT N.A. CITIBANKAS NOTES COLLATERAL AGENT N.A. CITIBANKMORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.MORGAN STANLEY SENIOR FUNDING, INC.NXP USA, INC.NXP USA, INC.CHIP PACKAGING TECHNOLOGIES, LLCAS COLLATERAL AGENT N.A. CITIBANKRelease, Dec 2015MORGAN STANLEY SENIOR FUNDING, INC.Security interest, Dec 2015MORGAN STANLEY SENIOR FUNDING, INC.Release, Jun 2016MORGAN STANLEY SENIOR FUNDING, INC.Release, Sep 2016SHENZHEN XINGUODU TECHNOLOGY CO., LTD.Security interest, Feb 2019MORGAN STANLEY SENIOR FUNDING, INC.Release, Sep 2019
AssignmentReel/Frame: 028560/0842Recorded: Jul 17, 2012

From

NAVAS KHAN ORATTI KALANDARInventor
Jul 10, 2012
BOON YEW LOWInventor
Jul 10, 2012
LAN CHU TANInventor
Jul 10, 2012
→

To

FREESCALE SEMICONDUCTOR, INC.

OtherReel/Frame: 030256/0471Recorded: Apr 20, 2013

From

FREESCALE SEMICONDUCTOR, INC.
Oct 31, 2012
→

To

AS NOTES COLLATERAL AGENT N.A. CITIBANK

OtherReel/Frame: 030256/0544Recorded: Apr 20, 2013

From

FREESCALE SEMICONDUCTOR, INC.
Oct 31, 2012
→

To

AS NOTES COLLATERAL AGENT N.A. CITIBANK

OtherReel/Frame: 030256/0625Recorded: Apr 20, 2013

From

FREESCALE SEMICONDUCTOR, INC.
Oct 31, 2012
→

To

AS NOTES COLLATERAL AGENT N.A. CITIBANK

OtherReel/Frame: 030633/0424Recorded: Jun 18, 2013

From

FREESCALE SEMICONDUCTOR, INC.
May 21, 2013
→

To

AS NOTES COLLATERAL AGENT N.A. CITIBANK

OtherReel/Frame: 031591/0266Recorded: Nov 6, 2013

From

FREESCALE SEMICONDUCTOR, INC.
Nov 1, 2013
→

To

AS NOTES COLLATERAL AGENT N.A. CITIBANK

ReleaseReel/Frame: 037357/0614Recorded: Dec 21, 2015

From

AS COLLATERAL AGENT N.A. CITIBANK
Dec 7, 2015
→

To

FREESCALE SEMICONDUCTOR, INC.

ReleaseReel/Frame: 037357/0633Recorded: Dec 21, 2015

From

AS COLLATERAL AGENT N.A. CITIBANK
Dec 7, 2015
→

To

FREESCALE SEMICONDUCTOR, INC.

ReleaseReel/Frame: 037357/0652Recorded: Dec 21, 2015

From

AS COLLATERAL AGENT N.A. CITIBANK
Dec 7, 2015
→

To

FREESCALE SEMICONDUCTOR, INC.

Security InterestReel/Frame: 037486/0517Recorded: Jan 12, 2016

From

N.A. CITIBANK
Dec 7, 2015
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

Security InterestReel/Frame: 037518/0292Recorded: Jan 13, 2016

From

N.A. CITIBANK
Dec 7, 2015
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

Security InterestReel/Frame: 041703/0536Recorded: Feb 1, 2017

From

N.A. CITIBANK
Dec 7, 2015
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

Security InterestReel/Frame: 053547/0421Recorded: Dec 10, 2019

From

N.A. CITIBANK
Dec 7, 2015
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

OtherReel/Frame: 038017/0058Recorded: Mar 7, 2016

From

NXP B.V.
Feb 18, 2016
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 039361/0212Recorded: Jul 14, 2016

From

NXP B.V.
Feb 18, 2016
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 042762/0145Recorded: May 9, 2017

From

NXP B.V.
Feb 18, 2016
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 042985/0001Recorded: May 9, 2017

From

NXP B.V.
Feb 18, 2016
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 051029/0001Recorded: Oct 22, 2019

From

NXP B.V.
Feb 18, 2016
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 051029/0387Recorded: Oct 22, 2019

From

NXP B.V.
Feb 18, 2016
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 051030/0001Recorded: Oct 22, 2019

From

NXP B.V.
Feb 18, 2016
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

AssignmentReel/Frame: 051145/0184Recorded: Oct 22, 2019

From

NXP B.V.
Feb 18, 2016
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

OtherReel/Frame: 039138/0001Recorded: Jun 16, 2016

From

FREESCALE SEMICONDUCTOR, INC.
May 25, 2016
→

To

MORGAN STANLEY SENIOR FUNDING, INC.

ReleaseReel/Frame: 040928/0001Recorded: Nov 7, 2016

From

MORGAN STANLEY SENIOR FUNDING, INC.
Jun 22, 2016
→

To

NXP B.V.

ReleaseReel/Frame: 052915/0001Recorded: Jan 17, 2020

From

MORGAN STANLEY SENIOR FUNDING, INC.
Jun 22, 2016
→

To

NXP B.V.

ReleaseReel/Frame: 040925/0001Recorded: Sep 21, 2016

From

MORGAN STANLEY SENIOR FUNDING, INC.
Sep 12, 2016
→

To

NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.

ReleaseReel/Frame: 052917/0001Recorded: Feb 17, 2020

From

MORGAN STANLEY SENIOR FUNDING, INC.
Sep 12, 2016
→

To

NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.

Name ChangeReel/Frame: 040632/0001Recorded: Nov 8, 2016

From

FREESCALE SEMICONDUCTOR, INC.
Nov 7, 2016
→

To

NXP USA, INC.

MergerReel/Frame: 044209/0047Recorded: Sep 21, 2017

From

FREESCALE SEMICONDUCTOR INC.
Nov 7, 2016
→

To

NXP USA, INC.

Security InterestReel/Frame: 048734/0001Recorded: Feb 20, 2019

From

MORGAN STANLEY SENIOR FUNDING, INC.
Feb 17, 2019
→

To

SHENZHEN XINGUODU TECHNOLOGY CO., LTD.

ReleaseReel/Frame: 050744/0097Recorded: Sep 10, 2019

From

MORGAN STANLEY SENIOR FUNDING, INC.
Sep 3, 2019
→

To

NXP B.V.

ReleaseReel/Frame: 050745/0001Recorded: Sep 10, 2019

From

MORGAN STANLEY SENIOR FUNDING, INC.
Sep 3, 2019
→

To

NXP B.V.

AssignmentReel/Frame: 068541/0903Recorded: Sep 10, 2024

From

NXP USA, INC.
Jul 31, 2024
→

To

CHIP PACKAGING TECHNOLOGIES, LLC