ExamPat

Tuan H Nguyen

USPTO Patent Examiner·Active 2012 to 2022

Tuan H Nguyen is a USPTO patent examiner who has handled 21 ex parte reexaminations between 2012 and 2022. These reexams concentrate in Electrical & Electronic, Physics & Instruments, and Mechanical & Manufacturing. ExamPat indexes the full prosecution record for each of these cases, including office-action grounds, certificate outcomes, and downstream PTAB and federal-circuit decisions.

Filings by year

4
12
5
13
2
14
2
15
2
16
3
18
1
20
2
22

Technology mix

Electrical & Electronic12 (57%)
Physics & Instruments6 (29%)
Mechanical & Manufacturing2 (10%)
Chemistry & Materials1 (5%)

Compare against all examiners

Eight side-by-side metrics: case volume, pendency, OAs per reexam, rejection mix, SNQ denial rate, certification rate, and PTAB appeal rate, with a Δ column showing where this examiner runs higher or lower than the corpus.

  • Average and median pendency, both for this examiner and the corpus
  • Rejection basis split (102 / 103 / 112) head-to-head
  • Certification, SNQ denial, and PTAB appeal rates

Certificate outcome distribution

How this examiner's certificates split across the six possible outcomes: all claims confirmed, confirmed with amendment, confirmed with new claims, mixed, or all claims canceled. Includes share comparison to the corpus distribution.

  • Count and share for each of the six outcome buckets
  • Δ vs. corpus distribution in percentage points
  • Useful for setting realistic patent-owner expectations

Event-to-event timing

Median time for this examiner's cases at each prosecution stage, from filing to first office action, filing to NIRC, and filing to certificate, with corpus comparison and sample size.

  • Median in months per transition
  • Side-by-side with the corpus median
  • n column showing how many of this examiner's cases completed each transition

vs. all examiners

Certificate outcome distribution

Event-to-event timing (median)

Recent reexaminations (21)

View all in dashboard →
Control #FiledPatentTitlePendencyStatus
90/015,143Oct 27, 202210,396,230BACKSIDE CONTACT SOLAR CELLS WITH SEPARATED POLYSILICON DOPED REGIONS10 moClosed
90/014,962Feb 22, 202210,063,210METHODS FOR PRODUCING PIEZOELECTRIC BULK AND CRYSTALLINE SEED LAYERS OF DIFFERENT C-AXIS ORIENTATION DISTRIBUTIONS—Closed
90/014,520May 28, 20208,492,828Vertical-Type Non-Volatile Memory Devices7 moClosed
90/014,173Aug 1, 201810,002,717HIGH PERFORMANCE LITHIUM-ION CAPACITOR LAMINATE CELLS10 moClosed
90/014,127Apr 20, 20189,219,185CMOS INTEGRATED METHOD FOR THE FABRICATION OF THERMOPILE PIXEL WITH UMBRELLA ABSORBER ON SEMICONDUCTOR SUBSTRATE12 moClosed
90/014,092Feb 27, 20186,423,900ACTIVE COVER PLATE FOR AN ELECTRICAL OUTLET10 moClosed
90/013,787Jul 25, 20166,756,318NANOLAYER THICK FILM PROCESSING SYSTEM AND METHOD20 moClosed
90/013,725Apr 15, 20169,070,851Wafer-Level Light Emitting Diode Package and Method of Fabricating the Same14 moClosed
90/013,566Aug 14, 20158,890,236SEMICONDUCTOR DEVICE2 moClosed
90/013,555Jul 27, 20156,908,316ELECTRICAL CONNECTOR WITH ACCURATE MEASURING BENCHMARKS41 moClosed
90/013,224Apr 29, 20147,403,872METHOD AND SYSTEM FOR INSPECTING MANUFACTURED PARTS AND SORTING THE INSPECTED PARTS56 moClosed
90/013,220Apr 23, 20148,421,005SYSTEMS AND METHODS FOR TRANSFER OF IONS FOR ANALYSIS14 moClosed
90/013,051Nov 6, 20138,322,225SENSOR PACKAGE ASSEMBLY HAVING AN UNCONSTRAINED SENSE DIE13 moClosed
90/012,964Sep 30, 20136,936,851SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME14 moClosed
90/012,840Aug 7, 20136,848,322Apparatus and Method for Testing Weld Integrity17 moClosed
90/012,842Apr 15, 20137,284,447Apparatus and Method for Testing Weld Integrity21 moClosed
90/012,778Jan 30, 20136,504,253STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST BODY OF SEMICONDUCTOR MATERIAL OVERLAID BY A SECOND BODY OF SEMICONDUCTOR MATERIAL COMPOSITE STRUCTURE USING ELECTRIC CONNECTION STRUCTURE34 moClosed
90/012,584Sep 14, 20126,164,791BACKLIGHT SOURCE DEVICE13 moClosed
90/012,640Sep 14, 20128,017,444ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE—Closed
90/012,518Sep 12, 20126,928,872Integrated Gyroscope of Semiconductor Material with at Least One Sensitive Axis in the Sensor Plane13 moClosed
90/012,499Sep 11, 20126,504,253STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST BODY OF SEMICONDUCTOR MATERIAL OVERLAID BY A SECOND BODY OF SEMICONDUCTOR MATERIAL COMPOSITE STRUCTURE USING ELECTRIC CONNECTION STRUCTURE38 moClosed

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