ExamPat

Tuan H Nguyen

USPTO Patent Examiner·Active 2012 to 2022

Tuan H Nguyen is a USPTO patent examiner who has handled 21 ex parte reexaminations between 2012 and 2022. These reexams concentrate in Electrical & Electronic, Physics & Instruments, and Mechanical & Manufacturing. ExamPat indexes the full prosecution record for each of these cases, including office-action grounds, certificate outcomes, and downstream PTAB and federal-circuit decisions.

Filings by year

4
12
5
13
2
14
2
15
2
16
3
18
1
20
2
22

Technology mix

Electrical & Electronic12 (57%)
Physics & Instruments6 (29%)
Mechanical & Manufacturing2 (10%)
Chemistry & Materials1 (5%)

Compare against all examiners

Eight side-by-side metrics: case volume, pendency, OAs per reexam, rejection mix, SNQ denial rate, certification rate, and PTAB appeal rate, with a Δ column showing where this examiner runs higher or lower than the corpus.

  • Average and median pendency, both for this examiner and the corpus
  • Rejection basis split (102 / 103 / 112) head-to-head
  • Certification, SNQ denial, and PTAB appeal rates

Certificate outcome distribution

How this examiner's certificates split across the six possible outcomes: all claims confirmed, confirmed with amendment, confirmed with new claims, mixed, or all claims canceled. Includes share comparison to the corpus distribution.

  • Count and share for each of the six outcome buckets
  • Δ vs. corpus distribution in percentage points
  • Useful for setting realistic patent-owner expectations

Event-to-event timing

Median time for this examiner's cases at each prosecution stage — filing to first office action, filing to NIRC, and filing to certificate — with corpus comparison and sample size.

  • Median in months per transition
  • Side-by-side with the corpus median
  • n column showing how many of this examiner's cases completed each transition

Recent reexaminations (21)

Control #FiledPatentTitlePendencyStatus
90/015,143Oct 27, 202210,396,230BACKSIDE CONTACT SOLAR CELLS WITH SEPARATED POLYSILICON DOPED REGIONS10 moClosed
90/014,962Feb 22, 202210,063,210METHODS FOR PRODUCING PIEZOELECTRIC BULK AND CRYSTALLINE SEED LAYERS OF DIFFERENT C-AXIS ORIENTATION DISTRIBUTIONS—Closed
90/014,520May 28, 20208,492,828Vertical-Type Non-Volatile Memory Devices7 moClosed
90/014,173Aug 1, 201810,002,717HIGH PERFORMANCE LITHIUM-ION CAPACITOR LAMINATE CELLS10 moClosed
90/014,127Apr 20, 20189,219,185CMOS INTEGRATED METHOD FOR THE FABRICATION OF THERMOPILE PIXEL WITH UMBRELLA ABSORBER ON SEMICONDUCTOR SUBSTRATE12 moClosed
90/014,092Feb 27, 20186,423,900ACTIVE COVER PLATE FOR AN ELECTRICAL OUTLET10 moClosed
90/013,787Jul 25, 20166,756,318NANOLAYER THICK FILM PROCESSING SYSTEM AND METHOD20 moClosed
90/013,725Apr 15, 20169,070,851Wafer-Level Light Emitting Diode Package and Method of Fabricating the Same14 moClosed
90/013,566Aug 14, 20158,890,236SEMICONDUCTOR DEVICE2 moClosed
90/013,555Jul 27, 20156,908,316ELECTRICAL CONNECTOR WITH ACCURATE MEASURING BENCHMARKS41 moClosed
90/013,224Apr 29, 20147,403,872METHOD AND SYSTEM FOR INSPECTING MANUFACTURED PARTS AND SORTING THE INSPECTED PARTS56 moClosed
90/013,220Apr 23, 20148,421,005SYSTEMS AND METHODS FOR TRANSFER OF IONS FOR ANALYSIS14 moClosed
90/013,051Nov 6, 20138,322,225SENSOR PACKAGE ASSEMBLY HAVING AN UNCONSTRAINED SENSE DIE13 moClosed
90/012,964Sep 30, 20136,936,851SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME14 moClosed
90/012,840Aug 7, 20136,848,322Apparatus and Method for Testing Weld Integrity17 moClosed
90/012,842Apr 15, 20137,284,447Apparatus and Method for Testing Weld Integrity21 moClosed
90/012,778Jan 30, 20136,504,253STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST BODY OF SEMICONDUCTOR MATERIAL OVERLAID BY A SECOND BODY OF SEMICONDUCTOR MATERIAL COMPOSITE STRUCTURE USING ELECTRIC CONNECTION STRUCTURE34 moClosed
90/012,640Sep 14, 20128,017,444ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE—Closed
90/012,584Sep 14, 20126,164,791BACKLIGHT SOURCE DEVICE13 moClosed
90/012,518Sep 12, 20126,928,872Integrated Gyroscope of Semiconductor Material with at Least One Sensitive Axis in the Sensor Plane13 moClosed
90/012,499Sep 11, 20126,504,253STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST BODY OF SEMICONDUCTOR MATERIAL OVERLAID BY A SECOND BODY OF SEMICONDUCTOR MATERIAL COMPOSITE STRUCTURE USING ELECTRIC CONNECTION STRUCTURE38 moClosed

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